Item#
KOC RS Heat Sink Compound 24X20G
Compound for thermal coupling and heat
Product Description
Compound to increase the thermal conductivity and the efficient heat dissipation at electronic components.
Features
• High thermal conductivity.
• Excellent moisture buffer.
• Low metallic impurity content.
| Productidentification | |
|---|---|
| EAN / GTIN | 5412386852817 |
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