Item#
KOC Heat Sink Compound 12X100G
Compound for thermal coupling and heat dissipation
Product Description
Compound to increase the thermal conductivity and the efficient heat dissipation at electronic components. Features • High thermal conductivity. • Excellent moisture buffer. • Low metallic impurity content.
| Productidentification | |
|---|---|
| EAN / GTIN | 5412386064708 |
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